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| Specs | |
|---|---|
| BatteryBattery | Si/C Li-Ion 5000 mAh |
| Body BuildBody Build | Glass front, glass back or eco leather back, magnesium alloy frame, titanium alloy folding mechanism |
| Body DimensionsBody Dimensions | Unfolded: 156.7 x 145.4 x 4.7 mm or 4.8 mm | Folded: 156.7 x 74.1 x 9.9 mm or 10.1 mm |
| Body WeightBody Weight | 231 g or 237 g (8.15 oz) |
| Camera FrontCamera Front | Single: 16 MP, f/2.2, (wide) |
| Camera RearCamera Rear | Triple: 50 MP, f/1.9, (wide), PDAF, OIS | 20 MP, f/2.4, 62mm (telephoto), PDAF, 2.5x optical zoom, OIS | 50 MP, f/2.0, 13mm (ultrawide), AF |
| Camera TelephotoCamera Telephoto | 50 MP, f/1.9, (wide), PDAF, OIS | 20 MP, f/2.4, 62mm (telephoto), PDAF, 2.5x optical zoom, OIS | 50 MP, f/2.0, 13mm (ultrawide), AF |
| Charging WiredCharging Wired | 66W wired | 5W reverse wired |
| Connectivity NetworkConnectivity Network | GSM / CDMA / HSPA / CDMA2000 / LTE / 5G |
| Connectivity USBConnectivity USB | USB Type-C 3.1, OTG, Display Port 1.2 |
| Connectivity WirelessConnectivity Wireless | Wi-Fi 802.11 a/b/g/n/ac/6e/7, dual-band, Wi-Fi Direct | 5.3, A2DP, LE, aptX HD | GPS (L1+L5), GLONASS (L1), BDS (B1I+B1c+B2a), GALILEO (E1+E5a), QZSS (L1+L5) | Yes |
| Display ResolutionDisplay Resolution | 2156 x 2344 pixels (~402 ppi density) |
| Display SizeDisplay Size | 7.92 inches, 201.6 cm | 2 | (~88.5% screen-to-body ratio) |
| Display TypeDisplay Type | Foldable LTPO OLED, 1B colors, 120Hz, HDR10+, 1600 nits (peak) |
| Identity BrandIdentity Brand | Honor |
| Identity ModelIdentity Model | Honor Magic V2 |
| Launch AnnouncedLaunch Announced | 2023, July 12 |
| Launch StatusLaunch Status | Available. Released 2023, July 27 |
| Memory InternalMemory Internal | 256GB 16GB RAM, 512GB 16GB RAM, 1TB 16GB RAM |
| Network 2G bandsNetwork 2G bands | GSM 850 / 900 / 1800 / 1900 |
| Network 3G bandsNetwork 3G bands | HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100 |
| Network 4G bandsNetwork 4G bands | 1, 2, 3, 4, 5, 7, 8, 12, 17, 18, 19, 20, 26, 28, 34, 38, 39, 40, 41, 66 |
| Network SpeedNetwork Speed | HSPA, LTE, 5G |
| Network TechnologyNetwork Technology | GSM / CDMA / HSPA / CDMA2000 / LTE / 5G |
| Platform ChipsetPlatform Chipset | Qualcomm SM8550-AB Snapdragon 8 Gen 2 (4 nm) - Intl | Qualcomm SM8550-AC Snapdragon 8 Gen 2 (4 nm) - China |
| Platform OSPlatform OS | Android 13, upgradable to Android 14, MagicOS 8 |
| SIM SIMSIM SIM | · Nano-SIM + | eSIM | · Nano-SIM + Nano-SIM |
