Honor Pad X9
Komponen | Spesifikasi |
Tanggal Rilis | Released 2023, July 06 |
Body | 495g, 6.9mm thickness |
Network | No cellular connectivity |
Sistem Operasi | Android 13, MagicOS 7.1 |
Penyimpanan | 128GB storage, no card slot |
Ukuran Display | 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio) |
Resolusi | 1200×2000 pixels |
Kamera Belakang | Foto : 5 MP, f/2.2, AF Video : 1080p@30fps Fitur : HDR |
Kamera Depan | Foto : 5 MP, f/2.2 Video : 1080p@30fps Fitur : |
Memory(RAM) | 4 GB RAM |
CPU | Octa-core (4×2.8 GHz Cortex-A73 & 4×1.9 GHz Cortex-A53) |
Chipset | Snapdragon 685 |
Baterai | Li-Po 7250 mAh, non-removable |
Fitur | Accelerometer |